高頻混壓板可以是FR4和高頻板材的混合,或者不同DK的高頻板材的混合,這種電路板具有耐高溫性能和優(yōu)異耐輻射性,這種結(jié)構(gòu)的高頻電路板能夠滿足局部高頻信號傳輸?shù)囊?,領(lǐng)智電路是一家專業(yè)提供TU862 PCB打樣,TU862 PCB加工,TU862 PCB批量制作等一站式印刷電路板的生產(chǎn)廠家。TU-862 HF/TU-86P HF High Tg halogen free materials are made of epoxy resin and E-glass fabric. Unlike conventional FR-4 material using brominated resin as flame retardant, TU-862 HF/TU-86P HF achieves flammability class of UL94V-0 by incorporating phosphorous and nitrogen compounds in the materials. The materials are compatible with the AOI process and exhibit the UV-block characteristic. TU-86P HF is designed for use with TU-862 HF for making multilayer printed wire boards. TU-862 HF is also available for single/double sided application. This series of green materials are designed to eliminate the use of halogenated resins due to the potential hazardous effects from the environmental concerns. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-862 HF laminates also exhibit superior chemical resistance, thermal stability for lead free soldering assembly and CAF resistance.
1. Applications
Backpanel, High performance computing
Line cards, Storage
Servers, Telecom, Base station
Office Routers
2. Performance and Processing Advantages
Low halogen and environmental friendly materials
Lead free process compatible
Compatible to PCB processes
Very low coefficient of thermal expansion
Moisture resistance
Anti-CAF capability
Higher Tg characteristics
3. Industry Approvals
IPC-4101E Type Designation : /127, /128, /130
IPC-4101E/130 Validation Services QPL Certified
UL Designation - ANSI Grade : FR-4.1
UL File Number: E189572
Flammability Rating: 94V-0
Maximum Operating Temperature: 130°C
4. Standard Availability Thickness: 0.002”[0.05mm] to 0.062” [1.58mm], available in sheet or panel form
Copper Foil Cladding: 1/3 to 5 oz (HTE) for built-up & double sides and H to 2 oz (MLS)
Prepregs: Available in roll or panel form Glass Styles: 106, 1080, 2113, 2116, 1506 and 7628, etc.